Electronics Forum | Fri Sep 28 16:49:48 EDT 2007 | davef
good * No IMC => bad Intermetallic growths are diffusion limited, and therefore the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m^2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the act
Industry News | 2017-11-15 20:16:33.0
Metcal announces that it was awarded a 2017 Global Technology Award in the category of Hand Soldering for its CV-5200 Soldering and Rework Systems with Connection Validation technology. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. This marks the company’s fifth award since its introduction at the beginning of 2017.
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
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