Electronics Forum | Tue Jan 05 18:19:40 EST 1999 | Dave F
| I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | Chrys | Hey Chrys: I
Electronics Forum | Fri Nov 27 08:58:39 EST 1998 | Des
I have a PCMCIA type pcb with an 0603 resistor situated exactly half way along the longest edge the device is 2mm form the edge of the pcb. I have experienced incidences of the device fracturing after breakout (hand operation) (pcbs are routed) Coul
Electronics Forum | Tue Dec 01 10:19:43 EST 1998 | Dave F
| I have a PCMCIA type pcb with an 0603 resistor situated exactly half way along the longest edge the device is 2mm form the edge of the pcb. I have experienced incidences of the device fracturing after breakout (hand operation) (pcbs are routed) Co
Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Wed Sep 30 11:57:19 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Wed Sep 30 11:56:46 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Mon Jun 29 13:54:54 EDT 1998 | Russ Miculich
Diane: I would suggest you contact Chip Supply in Florida and find out how and what they specify to their suppliers. They inspect, test, package, and distribute many suppliers chips for flip chip and other applications. I am sorry but I do not have
Electronics Forum | Fri Nov 17 14:36:17 EST 2006 | Fer
Good afternoon all, There is an issue in my company regarding flatness on SMDs. The part I am fabricating is a multilayer assembly of .175" by .175" by .049" thick. The part is made out of a multilayer copper clad PTFE with a tin finish surface. Af
Electronics Forum | Thu Feb 19 12:22:52 EST 2015 | dman97
Hi there. I have an IP3 machine that refuses to power up the MFU cart on side 1. I have already replaced the I/O card but still no dice. Is there a relay or fuse that I need to check to get this to power up? The machine will not operate the camera
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
