Full Site - : dicing (Page 7 of 16)

ASM Siemens SIPLACE CA

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen

Extension Electromechanical equipment HK Co.,Ltd

WALTS CO., LTD. Appoints Practical Components to Be Exclusive Representative for American Market

Industry News | 2015-02-22 17:49:35.0

Practical Components has added the WALTS Co., LTD to its extensive line of Dummy Components and Test Boards. Headquartered in Fukuoka, Japan, WALTS Co., LTD. develops and provides advanced test element group wafers (TEG) die/test kits. Their high-technology wafers are used extensively worldwide in wide ranging applications. WALTS collaborates on research with academic institutes on advanced assembly technologies. WALTS offers film sputtering and deposition, backgrinding, dicing service on test wafer/glass.

Practical Components, Inc.

Precision tools

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

Die Sort

Die Sort

New Equipment | Pick & Place

To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services.  Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution for you.

Syagrus Systems

Temporary Bonding Adhesive for Thin Wafer Handling

Industry News | 2016-08-17 09:26:56.0

AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.

AI Technology, Inc. (AIT)

Cognex Corporation Enters Into $1.3 Million OEM Agreement with Alphasem AG

Industry News | 2002-04-24 08:49:13.0

Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months

Cognex Corporation

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

Assembly Resource

Industry Directory | Manufacturer / Manufacturer's Representative

Sales/Marketing, Manufacturers Representatives, Used Equipment Sales

Creative Sensor Inc.

Industry Directory | Manufacturer

Creative Sensor Inc. is the world’s largest and foremost supplier of width line sensor camera modules (LSCM) for Automated Optical Inspection (AOI) applications.


dicing searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

Wave Soldering 101 Training Course
PCB Handling with CE

Software for SMT placement & AOI - Free Download.
best pcb reflow oven

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.