TI New and Original CD4093BE in Stock IC DIP-14, 2021+ package CD4093BE 4-Channel, 2-Input, 3V to 18V NAND Gate with Schmitt Trigger Input Today's Hot Deals： TCD2220 QFP Dice 12+ L9301-TR HSSOP36 ST 21+ CD4093BE DIP-14 TI 20+ 25AA512-I/P
Industry News | 2006-05-24 16:25:02.0
ENDICOTT, NY, May 23, 2006
Industry News | 2008-09-08 03:46:39.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.
Industry News | 2012-01-17 15:25:04.0
LPKFwill be exhibiting in booth #570 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2014-02-04 15:04:31.0
Creyr Innovation has been selected by Panasonic Factory Solutions Company of America as a value-added sales representative for microelectronics solutions in the New England area.
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2014-07-29 12:36:04.0
Panasonic Factory Solutions Company of America’s new process-flexible, flip chip bonder garnered the interest of North American high-reliability manufacturers—from photonics to high frequency devices—at Semicon West 2014.
Industry News | 2015-08-11 09:37:25.0
Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
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