Multi-die system-in-package with low inductance direct attach of module to system level PCB.
Industry Directory | Manufacturer
Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.
Industry Directory | Manufacturer
5N Plus is a Canadian producer of high-purity metals and compounds for electronic applications best known as the major supplier of Cadmium Telluride (CdTe) to First Solar.
Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. The decision whether to use a Die Co
New Equipment | Assembly Services
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
Industry News | 2009-09-09 20:07:33.0
Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the ti
TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
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