Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Industry News | 2018-02-14 10:19:15.0
Press Release DA 90 Low Temperature Die Attach Adhesive Series Materials
Industry News | 2018-02-14 10:21:37.0
Press Release DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Manufacturer
A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies
Used SMT Equipment | X-Ray Inspection
Configuration Complete X·ray Protection Cabinet With Safety Interlocks 160 Kv Microfocus Demountable Open X-ray Tube Transmission Target (-500 Nanometer Resolution} True X-ray Intensity (Txi) Control 10 Watts Target Power Qty.6 -
Industry News | 2013-09-05 20:26:22.0
Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
