Industry Directory | Manufacturer
5N Plus is a Canadian producer of high-purity metals and compounds for electronic applications best known as the major supplier of Cadmium Telluride (CdTe) to First Solar.
Industry Directory | Manufacturer
Manufacturer of sintering, electrically conductive materials. Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill.
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
Electronics Forum | Fri Aug 30 06:18:55 EDT 2002 | seje
Thanks Jim, that should help. And yes, there is light at the end of the tunnel.... now : ) -Sasu-
Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje
Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
GPD Global | https://www.gpd-global.com/co_website/loader-unloader-operations.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_saving-solder-mask-settings_topic1817.xml
Notes.The Paste and Solder Mask settings are located in "Preferences > Terminals > Lead Form > Settings". The FPX file contains the Component Dimensions
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