Full Site - : die attach wire bond (Page 5 of 51)

MVP Ultra 850G Component AOI Autoi

MVP Ultra 850G Component AOI Autoi

Used SMT Equipment | AOI / Automated Optical Inspection

Single lane 3 position conveyor; 12" x 12" work area; 5MP camera; die bond and wire bond inspection.

GES Associates LLC

MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages

Industry News | 2020-12-01 02:54:29.0

MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.

MacDermid Alpha Electronics Solutions

RBC Industries, Inc

Industry Directory | Manufacturer

Manufacturers of high performance epoxy and silicone resins for potting/encapsulating, coating, bonding, sealing, and die attach. Thermally conductive, UL listed systems for electronic, electrical, & industrial applications.

R&D Money

Industry Directory |

Quality precision die bonding / pick and place tools, collets, ejector pins, wire clamps

NEO Tech to Showcase Leading Medical Design & Manufacturing Solutions at MD&M Minneapolis 2016 Exhibition

Industry News | 2016-08-22 19:02:37.0

NEO Tech announces that it will highlight its medical design service solutions, as well as medical device repair and refurbishment, and miniaturization services for implantable medical electronics in booth 2445 at the 2016 MD&M Minneapolis Exhibition, scheduled to take place September 21-22 at the Minneapolis Convention Center.

NEO Technology Solutions (NEO Tech)

Inseto (UK) Ltd

Industry Directory |

Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2014-11-07 10:35:14.0

AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.

AI Technology, Inc. (AIT)

Direct Die Attachment

Direct Die Attachment

New Equipment | Assembly Services

Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati

S-Bond Technologies

ESEC

Industry Directory | Other

Supplier to backend semiconductor packaging.

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company


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