Full Site - : die attach wire bond (Page 10 of 51)

Molex

Industry Directory | Manufacturer

Molex is a global leader in interconnect solutions, as well as custom user-interfaces, membrane switches and flex circuits.

Global Applications Manager - LED

Career Center | South Plainfield, New Jersey USA | Sales/Marketing,Technical Support

Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh

MacDermid Alpha Electronics Solutions

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

TM 230 Solderable Conductive Adhesives

TM 230 Solderable Conductive Adhesives

New Equipment | Materials

TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as

YINCAE Advanced Materials, LLC.

InnospeXion ApS

Industry Directory | Manufacturer

Development and manufacturing of X-ray based inspection systems.

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Xray Systems for Electronics & Counterfeit

Xray Systems for Electronics & Counterfeit

New Equipment | Inspection

Counterfeit components are defined as; substitutes or unauthorised copies of a product, a product used in which the materials used or the performance of the product has changed without notice, or a substandard component misrepresented by the supplier

InnospeXion ApS

Process Engineer

Career Center | , South Carolina USA | Engineering

Position is located in the upstate of South Carolina with an established, stable company. Will assist in the start-up of die bonding equipment. Will assist in the development of processes and equipment necessary to product products. Will utilize S

Connecti*Pro

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Electronic Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering,Research and Development

Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ

Harris Corporation


die attach wire bond searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
convection smt reflow ovens

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

High Precision Fluid Dispensers