Full Site - : die bonder (Page 3 of 14)

Vimic Electronic Corporation

Industry Directory | Manufacturer

Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.

Assembly Resource

Industry Directory | Manufacturer / Manufacturer's Representative

Sales/Marketing, Manufacturers Representatives, Used Equipment Sales

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

Videos

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech

Precision tools

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

Tresky Automation launches new website

Industry News | 2023-11-20 15:38:12.0

The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design for productronica 2023. The new website includes different focus and structure for the bonder solutions, which should help selecting proper information.

Tresky AG

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

Finetech Shows Support for University Research

Industry News | 2012-02-07 16:16:09.0

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

Finetech


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