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Eclipse Industries

Industry Directory |

Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Industry News | 2013-01-04 08:55:03.0

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

Finetech

Fluxless soldering using formic acid vapor for optoelectronics

Industry News | 2023-11-20 15:33:13.0

Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

Tresky AG

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the MVP 850G AOI at Productronica 2013

Industry News | 2013-11-06 14:17:59.0

Machine Vision Products will be demonstrating its 850G inspection solutions on Booth 220 in Hall A2 at the Productronica 2013 exhibition.

Machine Vision Products, Inc

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

Machine Vision Products Demonstrates 850G Solutions For Inspection Of Back-End Processes Including Lead-Frames, Wire-Bond, Die And Epoxy At Semicon Taiwan 2012

Industry News | 2012-08-31 12:32:09.0

Carlsbad, CA – September 1, 2012: Machine Vision Products today announced they would be demonstrating their 850G Inspection solutions at the Semicon Taiwan 2012 exhibition. The exhibition is at the Taipei World Trade Center, Nangang Hall in Taipei, Taiwan from September 5-7 2012. Machine Vision Products are exhibiting on Booth #960 with Sigmatek Corp.

Machine Vision Products, Inc


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