Full Site - : die bonder (Page 7 of 14)

JAS, Inc. Awards MAN-Tech for Best Screen Printer Sales in 2013

Industry News | 2013-11-11 08:27:31.0

Juki Automation Systems (JAS) Inc. awarded MAN-TechSystems Best Screen Printer Sales 2013 at the recent awards banquet held during the Juki Americas National Sales meeting.

Juki Automation Systems

Product Manager

Career Center | Tewksbury, Massachusetts USA | Production,Purchasing

Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech

Mycronic Technologies AB

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Semicon West 2012

Industry News | 2012-07-06 19:44:05.0

Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Semicon West 2012

Industry News | 2012-07-06 19:44:24.0

Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Semicon West 2012

Industry News | 2012-07-06 19:44:43.0

Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.

Machine Vision Products, Inc

FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

New Equipment | IC Packaging

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon

Finetech

STI Capabilities

STI Capabilities

Videos

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its MVP 850 AOI Platform for at Semicon West 2015

Industry News | 2015-07-10 13:55:54.0

Carlsbad, CA – July 10, 2015: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850 Platform for Microelectronics and Packaging AOI platform at the Semicon West 2015 exhibition. The exhibition is at the Moscone Center in San Francisco from July 14-16 2015. Machine Vision Products are exhibiting at booth #6254 in the North Hall.

Machine Vision Products, Inc

HYBRID/MCM DESIGNER

HYBRID/MCM DESIGNER

New Equipment |  

This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal

CAD Design Software


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