Full Site - : die bonder (Page 9 of 14)

Highly Flexible and Fast SMD Assembly Machine - Essemtec Introduces New Cobra Pick-and-Place System at SMTA International

Industry News | 2010-09-29 23:17:20.0

Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.

ESSEMTEC AG

NEPCON China 2008 - FINEPLACER�Lambda

Industry News | 2008-04-07 21:09:26.0

FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.

Finetech

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Industry News | 2009-12-22 10:09:22.0

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools

Sensor Products Inc.

Saline Lectronics Announces New In-house Wire Bonding Capability

Industry News | 2015-08-11 09:37:25.0

Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services. 

Saline Lectronics, Inc

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Industry News | 2011-01-05 15:36:14.0

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Industry News | 2011-02-14 16:47:35.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

Finetech


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