Full Site - : die cut machine for flex circuit (Page 10 of 23)

Designing for Scored PCB Array Panelization Printed Circuit Board Manufacturing

Industry News | 2017-05-20 15:06:05.0

PCB array panelization can be a major challenge for PCB designers. Learn best practices for designing PCB boards for most efficient panelization.

Power Design Services

Gen3 Systems announces product line up for Southern Manufacturing

Industry News | 2017-03-07 09:28:32.0

Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands J19 and J20 at Southern Manufacturing, scheduled to take place March 21st – 23rd at FIVE in Farnborough, Hampshire.

Gen3 Systems

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Technical Library | 2020-12-24 02:50:56.0

A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.

University of Southampton

Gen3 Systems announces product line up for Southern Manufacturing

Industry News | 2018-01-16 10:38:59.0

Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands F35 and F60 at Southern Manufacturing, scheduled to take place February 6th – 8th at FIVE in Farnborough, Hampshire.

Gen3 Systems

NEPCON SOUTH CHINA 2015 Set for Shenzhen this August

Industry News | 2015-06-08 16:41:53.0

The Chinese stock market has seen dramatic growth in 2015, with startups and the Shenzhen Composite Index rising to unbelievable heights. Behind the huge growth is a commitment by the national government to facilitating the sustained growth of industries such as internet+ and information technology.

Reed Exhibitions

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Industry News | 2013-02-08 23:26:44.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.

Zymet, Inc

Nordson MARCH Receives Global Technology Award for FlexTRAK-CDS High-volume Plasma System

Industry News | 2016-10-11 19:03:14.0

Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.

MARCH Products | Nordson Electronics Solutions

Nordson TEST & INSPECTION Receives Global Technology Award for Assure FLEX E Component Counter

Industry News | 2022-11-07 19:39:39.0

Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), received a 2022 GLOBAL Technology Award in the category of ID Systems / Component Counters for its Assure FLEX E. The award was announced during a ceremony that took place Wednesday, Nov. 2, 2022, during SMTA International.

Nordson Corporation

LPKF to Exhibit In-House Prototyping Systems for Aerospace and Defense Products at AeroCon 2012

Industry News | 2012-02-23 15:17:01.0

LPKF will highlight its rapid PCB prototyping equipment and showcase the ProtoMat S63 in Booth #1027 at the upcoming AeroCon Exposition, scheduled to take place March 14-15, 2012 at the Fort Worth Convention Center in Texas.

LPKF Laser & Electronics

Juki Automation Systems and Storage Solutions Receive the 2017 NPI Award for Component Storage

Industry News | 2017-02-15 13:18:55.0

Juki Automation Systems today announced that the companies were awarded a joint 2017 NPI Award. The award was presented to the companies in the Component Storage category for the new ISM UltraFlex 3600 during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Juki Automation Systems


die cut machine for flex circuit searches for Companies, Equipment, Machines, Suppliers & Information

Midwest Circuit Technology
Midwest Circuit Technology

Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.

Manufacturer / Distributor

114 Barrington Town Square
Aurora, OH USA

Phone: 13309956900

High Throughput Reflow Oven

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Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
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Electronic Solutions R3

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