Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
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DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi
Electronics Forum | Tue Jul 13 11:21:28 EDT 2021 | stephendo
You may have to use an adaptor board. A small board with one footprint on one side and the other on the other side. Do not assume that the pin outs of the two parts are the same. I have seen smaller parts with a different pin out than the bigger part
Electronics Forum | Tue Jul 13 19:20:51 EDT 2021 | emeto
Just give them triple the price and they will love to make re-design. If you do what was suggested with the additional PCB, price might be close enough to triple.
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Parts & Supplies | Pick and Place/Feeders
Help customer solve problems of 750L machine May because of I'm in this area more than 4 years, I have some new feelings when my customers come across a problem. A Spain customer purchase a used JUKI 750L machine from another customer of mine
Parts & Supplies | Assembly Accessories
Detailed Product Description Original: Japan Name: IO Boards Model: 945 Brand: Samsung Usage: SM421 Stocks: Yes Samsung SM421 IO SMT PCB Assembly , 945 Main SMT Printed Circuit Board Assembly Description: Name: Main Boards Brand: Sam
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
www.unisoft-cim.com/prontoaoi.htm - ProntoAOI software from Unisoft is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Events Calendar | Tue Jun 23 00:00:00 EDT 2020 - Thu Jun 25 00:00:00 EDT 2020 | College Park, Maryland USA
Symposium on Counterfeit Parts and Materials
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | , Florida USA | Engineering,Production
� Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. � Will work with quality, design, and test on DFx and NPI. � Identify opportunities and drive implementati
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/different-tolerances_topic1618&OB=DESC_page2.html
Different tolerances - PCB Libraries Forum - Page 2 Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Different tolerances
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/case-and-package-assembly
Case & Package Assembly | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
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