The only portable reflow oven optimizers with statistical process control (SPC). Regardless of the recipe and what your reflow oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANT
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
New Equipment | Rework & Repair Equipment
The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software packet Eas
Easy-operation! Save energy! Good Price ! Environment friendly! Windows XP operation software with Chinese and English alternative. Whole system under integration control can analyze and display the failure. All production data can be saved comp
Industry News | 2015-03-07 18:35:19.0
SolderStar Ltd, a world leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, will be highlighting a number of innovative products, including its latest advancement in selective soldering, at SMT Hybrid Packaging in Nuremberg, Germany from 5 – 7th May 2015.
Industry News | 2021-03-30 11:44:23.0
Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Industry News | 2009-06-30 09:33:19.0
San Diego — June 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m. PDT in response to the overwhelming turnout to this Webinar when previously presented. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
Industry News | 2009-06-30 09:33:30.0
San Diego — June 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m. PDT in response to the overwhelming turnout to this Webinar when previously presented. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
Industry News | 2014-08-25 09:19:22.0
Seika Machinery, Inc. today announced that the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. will be part of the Tech Tours during SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
