Industry News | 2014-08-25 09:19:22.0
Seika Machinery, Inc. today announced that the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. will be part of the Tech Tours during SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2014-08-26 16:30:01.0
Seika Machinery, Inc. will debut the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. in Booth #835 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2012-10-29 13:09:31.0
, PP-Elektronix has become one of the leading electronics manufacturers in Poland. Maintaining a continuous high quality level has made its name known throughout Europe, America and Asia.
Used SMT Equipment | In-Circuit Testers
JDSU MTS6000A-C1004-CPSFP-CPXFP-CPE1BNC CPDS1BANT-CPE3DS3BNC-CPE4STM1 Highly integrated field optical test solution for single application The MTS-6000 is a compact and lightweight test platform designed for the installation and maintenance of
Used SMT Equipment | General Purpose Test & Measurement
JDSU MTS6000A-C1004-CPSFP-CPXFP-CPE1BNC CPDS1BANT-CPE3DS3BNC-CPE4STM1 Highly integrated field optical test solution for single application The MTS-6000 is a compact and lightweight test platform designed for the installation and maintenance of
Used SMT Equipment | General Purpose Test & Measurement
JDSU MTS6000A-C1004-CPSFP-CPXFP-CPE1BNC CPDS1BANT-CPE3DS3BNC-CPE4STM1 Highly integrated field optical test solution for single application The MTS-6000 is a compact and lightweight test platform designed for the installation and maintenance of
Industry News | 2009-11-19 14:31:38.0
San Diego — November 2009 — KIC announces that two of its products, designed to increase solar cell efficiency through accurate profiling and process optimization, tied for a Global Technology Award. KIC’s e-Clipse solar cell thermocouple (TC) attachment fixture and compact SunKIC profiler tied in the category of Solar Manufacturing Products. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2023-04-11 09:54:13.0
KIC will exhibit in Hall 4, Booth #126 at SMTconnect, scheduled to take May 9-11, 2023, in Nuremburg, German. KIC provides the most accurate Heat to Data™ solutions including its award-winning support with onsite service and application knowledge from the thermal process experts.
Industry News | 2023-08-29 07:09:47.0
In a special episode of Indium Corporation's free webcast series EV InSIDER Live, co-hosts Brian O'Leary and Loren McDonald will interview Darren Palmer, Vice President, Electric Vehicle Programs, Ford Model e, on the floor of The Detroit Auto Show. This unique session, titled How Ford is Driving the EV Revolution: An Exclusive Interview, will be broadcast live via LinkedIn on September 14, 11:30 a.m. EDT.
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
