Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Industry News | 2016-11-21 16:42:03.0
Altus Group is now offering its customers in the UK and Ireland GPD Global's automated dispense systems which in response to customer demand, now have an integrated Pick & Place capability.
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2011-04-22 21:36:56.0
GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
New Equipment | Soldering - Other
Soldering, Desoldering, Rework & Repair of Through-Hole/Surface Mount PCB's PACE's MBT 301 is a self contained, 2 channel rework station that offers high capacity, low temperature SMT/Thru-Hole soldering, desoldering and repair. The unit features 2
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
Industry News | 2017-01-21 08:16:49.0
Welcome to this Bob Willis “Defect of the Month” video This month we cover Poor Hole Fill on PCBs during Soldering https://www.youtube.com/watch?v=BlSF9ubGEA8
Industry News | 2012-07-18 14:43:36.0
ACD, announces that it has been working with Global Stencil, Inc. for 10 years.
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