Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry
We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Jan 09 19:55:14 EST 2014 | padawanlinuxero
Hello! I have a problem with one of the products here, we use a pallet to run the board on the solder wave, when the board gets solder and you inspect the board you notice that for some reason the first pcbs that touches the wave are ok, even a litt
Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef
Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl
on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev
