Electronics Forum | Sat Dec 14 15:25:31 EST 2002 | MA/NY DDave
Hi To me, something seems wrong with your process. I have never had to do what you are suggesting, yet I can imagine your difficulty with fluffy (easily floating) components. I won't give all the technical details, instead I would ask you to have
Electronics Forum | Wed Dec 18 11:38:53 EST 2002 | johnw
Soup mix works well for this as well.......
Electronics Forum | Fri Dec 13 19:01:14 EST 2002 | Tooling Guy
I have heard of people using tiny lead-shot filled bags to hold down thru-hole components on circuit boards while running through a wave solder machine on selective solder pallets. How successful has this been? What kind of material is being used f
Electronics Forum | Mon Dec 16 15:12:05 EST 2002 | sueph
I made a small bean bag from 100% cotton filled with rice, to hold down small resistors that wanted to tilt over solder wave. It worked fairly well as long as I didn't try to take it off the components to soon, as sometimes they would want to stick
Electronics Forum | Wed Dec 18 11:59:18 EST 2002 | russ
We sometime use a temporary solder mask to "glue the parts down" if bean bags don't work Russ
Electronics Forum | Sat Dec 14 10:10:04 EST 2002 | davef
This is a good idea. Heck, you could fill the bags with sand, if you wanted. Like anything else in the shop, bean bags require attention and maintenance. If you don't, eventually the seams on the bags loosen / break and you have to do a "clean-u
Electronics Forum | Mon Dec 16 09:59:57 EST 2002 | blnorman
We had the same problem and solution with one of our components on one of our lines. Don't know for sure what the "weight" was that they used, but it did solve the problem. Since then the same line is looking a putting an adhesive on the part to ho
Electronics Forum | Fri Dec 20 16:47:12 EST 2002 | Tooling Guy
Thanks for all of your input. Soup mix??? well at least i got a chuckle from that one. :) Anyway got some good ideas here and going to try some of them out. Thanks again. Tooling Guy
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
