New Equipment | Industrial Automation
About Kokusai Electric Kokusai Electric is a leading company in providing high-productivity batch processing systems and services for memory, foundry and logic customers. Kokusai Electric produces semiconductor manufacturing equipment that leverages
Our experienced engineers will design an electro/mechanical solution to interface between your product and your test instruments. Circuit Check develops hot mock-up and custom stand-alone functional tests for circuit cards, backplane boards and card
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Used SMT Equipment | Soldering - Reflow
Seven zone oven with superior water cooling for demanding lead free temperatures Condition: Superior to inline with its age Facilities: 480 Volt/60Hz Dimms: 199.2"x56.3"x49.8" @ ~4,000lbs Machine Length: 199.2′ (5060.7 mm) Mac
Used SMT Equipment | Pick and Place/Feeders
Yeah it's old, but it is a working placement machine, spare parts available, and it's cheap. Specifications: 4 spindle head ULC's: 4m/p circular & 4m/p circular Facilities: 230V, 3phase Dimms: 66"x86" at 6,000 lbs DOM: 1993
Used SMT Equipment | Screen Printers
Windows XP Underscreen Cleaner Autopaste Dispense Closed loop pressure head Enhanced 2D Inspection (Bridge Vision, Contrast Pad Coverage, Paste Transfer, Stencil Blockage, Stencil Bridge Vision, Texture Pad Coverage) Facilities: 2
Used SMT Equipment | Depanelizers / Routers
Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation for programming rout
Used SMT Equipment | Pick and Place/Feeders
Beautifully maintained GC30 . 01005 to 30mm sq components at 32kcph. Large board! Model: 4993A Single Beam - Lightning Head PSV NPI qty,2 Nozzle changers Cycles: 63M Facilities: 200 - 240VAC, 3phase 60Hz Dimms: 66" x
Used SMT Equipment | Soldering - Reflow
10 zone reflow oven with superior water cooling - plenty of cooling for lead free Edge/Mesh combo conveyor Water cooled for superior cooling, chillers available Chain oilers Dual cooling section Left to right transfer Facilit
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