Electronics Forum | Wed Feb 12 20:19:05 EST 2020 | nizar
Hi All, I have pick DIMM connector using chuck nozzle. Shape data already refer to physical size. Unfortunately, connector drop during pick up, and have many dislodge. Can we understand what might be the reason ?
Electronics Forum | Thu Jun 10 04:52:36 EDT 1999 | Gyver
Hello all! Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the proble
Electronics Forum | Thu Jun 10 04:54:10 EDT 1999 | Gyver
| Hello all! | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the pr
Electronics Forum | Thu Feb 13 04:04:36 EST 2020 | nizar
Hi Tommy, Thanks for the reply. We use chuck nozzle and grip the dimm connector body to pick up. The concern is; we do pick up 2 same connector but different component size (height and width) due to different company. So, we create two different
Electronics Forum | Tue Jan 05 21:01:40 EST 2021 | brianjones
We are looking at setting up a memory module conveyor belt with a stacker and de-stacker. I will need to handle DDR3 and DDR4 Long DIMM and SODIMM. I will be mounting an image camera under and over the modules. Looks like an edge conveyor would be be
Electronics Forum | Tue Nov 22 21:57:17 EST 2016 | Miche
Hello Dears, I'm a small CS Engineering at Taiwan.There are some problem on DIMM connector area with poor solderability at ODM. It was random on Dimm connector area and the SMT area is fine. At the same time, there were other PCB vendor's product whi
Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS
Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple
Electronics Forum | Tue Sep 21 13:24:17 EDT 2004 | GS
Hello, does any one please can tell me if any Standard says how much is the Total Ion Contamination ( ugr/NaCl sqcm equivalent, Br- in particular way) allowed on Connector surface/body ? (ie. DIMM connectors, and similar). Many Thanks in advan
Electronics Forum | Sat Sep 25 03:44:38 EDT 2004 | GS
Thanks Davef, unfotunately in order to keep TIC of PBA inside our customer TIC requirements, we have to pre-wash (DI water only)connectors before assembly. Too high level of Br- continuosly get released by connectors molding compound. Our assemb
Electronics Forum | Sat Aug 18 11:23:10 EDT 2007 | Learn From U
Hi All, Via X-rays, we found solder voids appear on PTH location, especially on Dimm connectors area. We think this should be related to PCB issue as we found solder unable to fill up the PTH hole during bare board testing at wave soldering machi
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