Industry Directory | Consultant / Service Provider / Manufacturer
Innoventions manufactures the RAMCHECK LX line of benchtop DRAM memory test equipment for servers, desktops and laptops. RAMCHECK LX will test DDR4, DDR3, DDR2, DDR, SDRAM, including SO-DIMM and DIMM.
esd package (electro-static dissipating) antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: for 10 long dimm / 20 so dimm
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: combo for long dimm / so dimm Made by SHINLY plastics corporation www.shinly.com.tw
Used SMT Equipment | Pick and Place/Feeders
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
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Used SMT Equipment | Pick and Place/Feeders
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
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Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Career Center | San Jose, Canillo | Management
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #6 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
Career Center | San Jose, California USA | Management,Production
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-present-at-smta-guadalajara-expo-and-tech-forum
optimum quality control is maintained. Fine-pitch micro-connectors, compact peripheral component interface (cPCI) connectors, dual in-line memory module (DIMM
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10789299-panasonic-ac-servo-motor-msma082p1a-for-samsung-sm321-x-axis-motor.html
; Dimm FC07-000194A BLOCK-THETA_PULLEY_BASE FC09-001521A 4-MIRROR_CUSHION J49011017A CPU I5-750 (2.66GHZ) J50011012A DRAM_DDR3 DDR3 2G PC3-10600U J66121027A COUPLING J70652678A ROLLER SHAFT-2432 AM03-004982A ASSY, BOARD-SM411
