Electronics Forum | Tue Jan 06 21:19:05 EST 1998 | Dominic Nguyen
We use no clean paste and sometimes experience flux splattering which gives spot on gold fingers. Need help in analize the cause. thx.
Electronics Forum | Tue Aug 16 06:20:34 EDT 2022 | bukas
it can be a bad contact with backboard. clean the slot and gold fingers with contact cleaner and push it in and out a few times.
Electronics Forum | Wed Mar 21 16:32:03 EST 2001 | mparker
The root cause is dependant on the type of solder "splash", ball, whatever, that you are seeing post reflow. If it is smears, then cleaning the stencil underside is probably the answer. Are you using automatic wipers? How many print cycles between w
Electronics Forum | Fri May 08 16:30:59 EDT 1998 | Chrys
| I am running boards with gold fingers on a pallet for | masking purposes. The pallets worked fine for a while | but know the gold fingers are getting solder on them. We | have tried everythin: new pallets, cleaning the pallet | and board to be s
Electronics Forum | Tue May 19 08:48:05 EDT 1998 | Aric Parr
| | I am running boards with gold fingers on a pallet for | | masking purposes. The pallets worked fine for a while | | but know the gold fingers are getting solder on them. We | | have tried everythin: new pallets, cleaning the pallet | | and boa
Electronics Forum | Wed Jun 30 17:58:01 EDT 1999 | Boca
| My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side it wo
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
Electronics Forum | Thu Jul 06 13:31:35 EDT 2000 | Michael Parker
Thanks Dave for the right methods that will get Patrick out of his mess. As long as one is a "Do it yurselfer". I still advocate having the supplier accept responsibility and clean the boards. After a bit of elbow grease, some cussin' and lost time I
