esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr Specification: 50 so dimm Made by SHINLY plastics corporation www.shinly.com.tw
This is a video of the Universal GX-11S (4992B) placing components (0402, 0603, 0805, SOIC24, and QFP80) onto a pcb. The machine runs twice, once with automatic z update (azu) and once in full speed. This machine is available from the Capital Equip
This is a running demon of the koh Young KY-3030 VAL Solder Paste Inspection machine. The video shows the machine catching an error introduced in the solder paste print. Machine available through the Capital Equipment Exchange. https://www.ce-exc
CMTL�s Advanced Qualification Test Summary for Ramtek Inc.�s Thermally Managed, Heat Dissipating, STABLCOR 1 Gigabyte, PC133, 168 pin DIMM Memory Module for Intel Corporations SBT2 ( Baytown )server. PASSED System Type:SBT2 (Baytown) Intel PC133 Ma
New Equipment | Industrial Automation
Contact Freely Manager: Leeta Wu Email: sales2@cambia.cn company website：www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Warranty: one year Condition: brand new and original Delivery t
New Equipment | Industrial Automation
Contact Freely Manager: Leeta Wu Email: sales2@cambia.cn company website：www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Warranty: one year Condition: brand new and original Delivery t
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Career Center | San Jose, California | Management
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #6 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
Career Center | , | Production
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
