This is a video of the Universal GX-11S (4992B) placing components (0402, 0603, 0805, SOIC24, and QFP80) onto a pcb. The machine runs twice, once with automatic z update (azu) and once in full speed. This machine is available from the Capital Equip
This is a running demon of the koh Young KY-3030 VAL Solder Paste Inspection machine. The video shows the machine catching an error introduced in the solder paste print. Machine available through the Capital Equipment Exchange. https://www.ce-exc
Industry News | 2015-03-20 05:30:21.0
A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded
Our experienced engineers will design an electro/mechanical solution to interface between your product and your test instruments. Circuit Check develops hot mock-up and custom stand-alone functional tests for circuit cards, backplane boards and card
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Industry News | 2021-09-10 11:17:18.0
Next Generation of 16GB & 32GB Industrial-Grade Innodisk JESD79-5 DDR5 SDRAM Offer improvements in Capacity, Speed and Voltage
Career Center | San Jose, California | Management
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #6 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
Career Center | , | Production
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
Career Center | San Jose, California USA | Management
Company: Ma Labs Job Title: Manufacturing Manager Headquartered in San Jose, as leading PC component distributor and DRAM & Flash products manufacturer worldwide, Ma Labs has specialized in memory modules since 1985. We provide a full range of memor
