Full Site - : disadvantages of nitrogen reflow ovens (Page 4 of 6)

Lead free Solder Paste & Use of nitrogen

Electronics Forum | Mon Jul 29 15:30:45 EDT 2013 | markhoch

Nitrogen in Reflow is grossly over-rated...., in my opinion, and in the opinion of several very well known SMT Industry "God Fathers". Way too much $$$, for a slight increase in the process window. If you profile your oven specifically for your pr

Nitrogen, Measuring the effectiveness of

Electronics Forum | Mon Sep 09 21:42:12 EDT 2002 | rwilliams

I have been involved with the reflow process for many years. However, my most recent position now includes the use of Nitrogen. In studying the reflow process and using Nitrogen, it seems to me that it would only make sense to be measuring the O2 lev

Re: Quick Purge of Reflow Oven for N2 Operation

Electronics Forum | Mon Jan 04 18:56:25 EST 1999 | Marc P.

| We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inor

Quick Purge of Reflow Oven for N2 Operation

Electronics Forum | Mon Dec 28 12:36:31 EST 1998 | Mark D.

We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inordi

Re: Quick Purge of Reflow Oven for N2 Operation

Electronics Forum | Mon Dec 28 15:03:14 EST 1998 | Earl Moon

| We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inor

EL Cap _ Missing & Shifted out of the Copper Pad

Electronics Forum | Fri Jul 21 03:51:06 EDT 2006 | Rob

Hi CKH, Here's some things to consider: 1) Moved by obstruction in/entering oven, such as nitrogen skirts 2) Incorrect air pressure/air leak in oven (large surface area on component) 3) Reflow temperature too hot & electrolyte/air in cap is expandi


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