Industry Directory | Manufacturer
WE ARE 1ST CLASS PCB 1st Class PCB is a company making 2 Layer & 4-Layer printed circuit boards. We bring you high quality, cheap, lead free boards (ENIG finish), manufactured in-house in China.
Industry Directory | Manufacturer
For Rapid PCB prototype deliveries (48 hours to 3 days), GSPK offer lead free HASL, IMMERSION SILVER or ENIG surface finishes. We can also committed to developing specialist PCBs i.e Ceramic and Heavy Copper PCBs
New Equipment | Fabrication Services
ENIG PCBs with red soldermask Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm Min. line width: 3 mils Min. line spacing: 3 mils Surface finishing: HASL
1) 4 layers board, 1.2mm thickness 2) Min. track width: 0.13mm 3) Min. track space: 0.12mm 4) Min. hole size: 0.3mm 5) Finish: immersion gold
Electronics Forum | Fri Oct 14 16:51:46 EDT 2005 | GS
It stands for Elettroless Nikel Immersion Gold, a kind of PCB finishing Entek (there are several kinds) is a brand name of an OSP (Organic Solderability Preservative)kind of PCB finishing. Regards............GS
Electronics Forum | Mon Jan 03 12:26:16 EST 2005 | barryg
We are looking at potentially doing a pcb that is enig finished as called out on its fab. drawing. We plan on a standard 63/37 water soluble paste. Is there any pro's and cons to this process with a pcb plated as such. What is the main advantage that
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Parts & Supplies | Circuit Board Assembly Products
1) 36*36mm/1up, Aluminium type: A5052 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Profile: Punch
Parts & Supplies | Circuit Board Assembly Products
1). PCB prototypes to small volume. 2). Standard FR-4, 0.3-5mm thick, 1-5 oz 3). 1-30 Lalyer 4). MOQ 1 PCS 5). 4 days delivery 6). HASL, ENIG, OSP etc finish
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2023-01-06 16:18:23.0
PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG.
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf
