Industry Directory | Manufacturer
WE ARE 1ST CLASS PCB 1st Class PCB is a company making 2 Layer & 4-Layer printed circuit boards. We bring you high quality, cheap, lead free boards (ENIG finish), manufactured in-house in China.
Industry Directory | Manufacturer
For Rapid PCB prototype deliveries (48 hours to 3 days), GSPK offer lead free HASL, IMMERSION SILVER or ENIG surface finishes. We can also committed to developing specialist PCBs i.e Ceramic and Heavy Copper PCBs
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Fabrication Services
ENIG PCBs with red soldermask Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm Min. line width: 3 mils Min. line spacing: 3 mils Surface finishing: HASL
Electronics Forum | Fri Oct 14 16:51:46 EDT 2005 | GS
It stands for Elettroless Nikel Immersion Gold, a kind of PCB finishing Entek (there are several kinds) is a brand name of an OSP (Organic Solderability Preservative)kind of PCB finishing. Regards............GS
Electronics Forum | Mon Jan 03 12:26:16 EST 2005 | barryg
We are looking at potentially doing a pcb that is enig finished as called out on its fab. drawing. We plan on a standard 63/37 water soluble paste. Is there any pro's and cons to this process with a pcb plated as such. What is the main advantage that
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Parts & Supplies | Circuit Board Assembly Products
1) 36*36mm/1up, Aluminium type: A5052 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Profile: Punch
Parts & Supplies | Circuit Board Assembly Products
1). PCB prototypes to small volume. 2). Standard FR-4, 0.3-5mm thick, 1-5 oz 3). 1-30 Lalyer 4). MOQ 1 PCS 5). 4 days delivery 6). HASL, ENIG, OSP etc finish
Technical Library | 2023-01-06 16:18:23.0
PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG.
Technical Library | 2021-07-06 21:20:38.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper.
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf
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