Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Events Calendar | Thu Mar 07 00:00:00 EST 2024 - Thu Mar 07 00:00:00 EST 2024 | Manassas,
Capital Expo & Tech Forum
Industry News | 2012-04-03 13:40:03.0
— IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® at the San Diego Convention Center in San Diego, Calif.
Industry News | 2012-06-11 18:41:32.0
Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
Industry News | 2012-06-11 18:41:48.0
Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
Industry News | 2019-08-12 20:12:26.0
IPC E-Textiles 2019, a two-day technical education workshop for innovators, technologists and OEMs/brands to learn about the latest developments, designs and manufacturing concepts in the converging industries of textiles and electronics, will feature 14 technical presentations, tours of the Drexel Center for Functional Fabrics, a special interactive session and an IPC D-70 E-Textiles Committee Standards meeting. IPC E-Textiles will take place at the Drexel University Center for Functional Fabrics in Philadelphia, Pa., September 10-11.
Industry News | 2009-05-01 02:01:51.0
MINNEAPOLIS, MN � The High Performance Electronics Cleaning and Coating Symposium technical committee is pleased to announce a call for abstracts for the industry's premier conference on cleaning for electronics assembly to be held September 30, 2009 in Coventry, England. The symposium will focus on all classes of high reliability and high performance electronics assembly and will include case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries.
Industry News | 2010-10-16 19:00:32.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, April 12–14, 2011, at the Mandalay Bay Resort & Convention Center, Las Vegas.
Industry News | 2011-09-06 13:17:52.0
IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, February 28-March 1, 2012, at the San Diego Convention Center, San Diego, Calif. Poster presentations offer exposure to key engineers, managers and executives attending the show.
Industry News | 2012-08-22 12:24:57.0
IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®