Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Technical Library | 2023-08-16 18:13:53.0
In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
Industry News | 2016-11-07 16:28:47.0
GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
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