Industry News | 2018-03-12 17:42:02.0
Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.
Industry News | 2018-03-26 21:05:47.0
Techcon will exhibit in Stand 1F38 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will display the TSR2000 Smart Dispensing Robot, new Smart Valve Controllers, TS8100 Series Positive Displacement Pump and TS5000/TS7000 Series Rotary Valves.
Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2010-07-06 11:20:59.0
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it has released a data sheet for its TS7000 Series Interchangeable Material Path (IMP) Rotary Valve. The TS7000 is the latest addition to Techcon’s rotary micro-valve family.
Industry News | 2009-04-19 23:40:32.0
Recently launched at the Apex exhibition in Las Vegas, Ovation Products' brand new and award-winning Stinger� adhesive dispenser is currently attracting attention industry-wide. Offering unmatched equipment utilization, Stinger enables dual function capability from a single screen printer.
Industry News | 2018-03-19 10:21:41.0
Techcon is pleased to introduce its new series of smart valve controllers: the TS550R, TS560R, TS570R and TS580R. Equipped with a universal power supply, the new smart valve controllers are fully ‘plug and play' and can be used immediately, anywhere in the world.
Industry News | 2019-12-17 08:19:54.0
Universal Instruments’ Advanced Process Lab (APL) is pleased to announce that GPD Global has placed a MAX II precision dispenser in its lab in New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.
Industry News | 2014-09-16 11:29:42.0
Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.
Industry News | 2015-08-23 14:25:07.0
Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Industry News | 2016-05-09 21:08:21.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
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