Industry News | 2016-05-09 21:08:21.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2016-07-07 14:54:56.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2019-05-13 17:45:44.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place June 4-6, 2019 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W4, Booth 353.
Industry News | 2017-05-01 14:59:41.0
Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.
Industry News | 2017-03-14 10:58:12.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.
Industry News | 2012-01-20 15:37:17.0
Techcon Systems will showcase its precision valves in Booth #2148 at the upcoming MD&M West Conference and Expo.
Industry News | 2009-04-27 18:00:47.0
DEK has launched its brand new Stinger* technology, an integrated low volume adhesive dispense module enabling dual function capability from a single screen printing platform. Ideal for customers working with mixed technology boards for example, Stinger is an easy-to-use, flexible system featuring innovative patented technology to eliminate unnecessary stoppages and raise productivity.
Industry News | 2019-08-13 06:43:28.0
Techcon today announced plans to exhibit at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. The company will showcase its TS8100 Series Progressive Cavity Pump, TS5000DMP-DCX Auger Valve, Smart Valve Controller Series and TSR2000 Smart Dispensing Robots in Booth 1E25. Additionally, attendees will be the first to preview the new Techcon Jet Valve and Controller, scheduled to launch later this year.
Industry News | 2013-10-10 11:11:32.0
Techcon Systems will showcase the newly released TS9000 Series Jet Tech valve in Hall A4, Stand 221 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2009-11-01 00:32:15.0
Garden Grove, CA — October 2009 — Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, launches video clips of all Techcon valves in action. The clips can be viewed online at www.techconsystems.com.
winsouce.jpg)