Industry News | 2024-03-26 13:05:01.0
BTU International, Inc. is proud to announce that its new Aurora platform of reflow ovens is designed to minimize the Cost of Ownership (CoO) while maximizing performance and operational value for its users. With a focus on precision, consistency, and efficiency, the Aurora platform sets a new standard for thermal processing in electronics manufacturing.
Industry News | 2010-06-11 14:56:31.0
Techcon Systems, a leading global supplier of fluid dispensing systems and accessories, will exhibit an impressive lineup of products with distributor Pacific Advanced Equipment (M) Sdn Bhd, in stand B06 at the upcoming NEPCON Malaysia. The event is scheduled to take place June 15-17, 2010, at the Penang International Sports Arena (PISA).
Industry News | 2016-04-07 16:17:04.0
ASM Assembly Systems can look back on a very successful APEX 2016 trade show. The two lines being shown, one a high-speed line with the latest DEK NeoHorizon and SIPLACE TX modules and the other a high-mix line with super-flexible SIPLACE SX, attracted lots of visitors. The industry professionals were especially impressed that ASM already has concrete products for its Smart #1 SMT Factory concept in its portfolio, making it the leading technology partner for the future of electronics manufacturing. One of these products was the SIPLACE BulkFeeder, an innovative feeder module for high-volume production that trade publication Circuit Assembly immediately honored with its highly respective NPI Award. The SIPLACE BulkFeeder holds up to 1.5 million loose components and feeds them with exceptional precision – without tapes or splicing and the associated risks. The concept of the ASM ProcessExpert is equally revolutionary. With its integrated 5D SPM (solder paste management) system, the world's first inline expert systems controls and optimizes printing processes fully automatically. Another innovation was shown at the booth of ASM distributor Technica: With the E by SIPLACE, ASM addresses customers and applications in the mid-speed, small-lot and prototype manufacturing segments.
Industry News | 2010-03-26 23:54:25.0
The Balver Zinn Group announces that Cobar Europe BV will introduce its new Aquasol Branded Water Soluble solder paste in booth #1876 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2011-09-28 19:53:50.0
AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.
Industry News | 2017-10-23 05:56:23.0
After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning To ensure you are equipped to get maximum benefit from the event, read our Webinar Guide https://www.bobwillis.co.uk/wp-content/uploads/2017/01/WebinarAttendance2017.pdf
Industry News | 2017-11-03 09:46:42.0
The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2018-11-07 14:41:49.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Industry News | 2010-02-25 23:27:16.0
MORRISVILLE, NC - February 2010 - Juki Corporation will showcase a range of leading products at the upcoming Virtual PCB, the industry’s only online tradeshow, scheduled to take place March 2-4, 2010 online at www.virtual-pcb.com.
Industry News | 2010-09-29 01:30:07.0
FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
