Industry News | 2019-11-27 01:33:15.0
ULT AG recently introduced the mobile soldering fume extraction unit LRA 160.1 for small and medium air pollutant quantities
Industry News | 2008-03-08 04:04:22.0
OSAKA, JAPAN � March 7, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate.
Industry News | 2006-04-20 12:26:41.0
Indium Corporation will highlight its Reliability Program at their exhibit at Nepcon East/Electro, May 10-11, 2006 in Boston, MA. Indium�s team of experts will be available at booth #3017 to answer questions and provide information.
Industry News | 2009-03-16 17:27:24.0
BALVE, GERMANY � March 2009 � The BALVER ZINN Group, a leading provider of high-quality anodes with various alloys as well as soft solders and special wires, announces that it has signed an agreement to promote, support, sell and distribute KIC's product range as part of KIC's �Value Added Reseller� base.
Industry News | 2013-03-25 15:21:46.0
OK International’s Metcal brand today announced the schedule for its 2013 Spring series of BGA rework and repair seminars.
Industry News | 2013-04-25 16:51:34.0
AIM Solder announces the addition of Rich Sales Co. as its representative for the complete AIM line of solder assembly materials in Arkansas, Louisiana, Oklahoma and Texas.
Industry News | 2013-04-30 11:03:26.0
AIM Solder has added PHASE 4, Inc. as its representative for the complete AIM line of solder assembly materials in Arizona and New Mexico.
Industry News | 2014-07-28 15:50:58.0
Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2014-10-08 21:22:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif. Dr. Lee's tutorial, Achieving High Reliability Lead-Free Soldering - Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m.
Industry News | 2015-01-20 23:40:52.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
