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Custom Test Fixtures

Custom Test Fixtures

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Intrinsic Quality is pleased to offer a variety of Test Fixture Development Services that include fixture building, tester interface building, harness building, troubleshooting, maintenance, design, and engineering. IQ’s fixtures are built to exactin

Intrinsic Quality LLC

Polyonics Tapes Protect Components From Harsh Environments

Industry News | 2011-10-03 14:26:46.0

Polyonics has introduced a family of temperature and chemical resistant tapes that remain dimensionally stable in extreme manufacturing environments including ultra-high temperatures up to 500°C.

Polyonics, Inc.

Staticide® ESD Safety Shield Is Now Available in Aerosol Form

Industry News | 2008-12-09 09:03:44.0

By customer demand, ACL Incorporated's long-lasting static dissipative coating called Staticide ESD Safety Shield is now available as an aerosol spray.

ACL Staticide, Inc.

Manage Power Dissipation During Test: Multitest’s MT9510 Provides Extended Temperature Control with XTC

Industry News | 2011-05-06 20:47:45.0

Multitest announces that the MT9510 now provides extended temperature control with its extended temperature calibration (XTC).

Multitest Elektronische Systeme GmbH

ACL Introduces ESD-Safe Finger Cots

Industry News | 2018-05-16 11:45:10.0

ACL introduces dissipative finger cots to its static control offerings for ESD applications including those that require chemical resistance. Available in latex and nitrile varieties, these finger cots are designed for manufacturing in S20.20 EPAs, ISO 5 and Class 100 Clean Rooms, and for manufacturing Class II static sensitivity devices.

ACL Staticide, Inc.

A Novel High Thermal Conductive Underfill For Flip Chip Appliation

Technical Library | 2014-02-27 15:30:20.0

Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices

YINCAE Advanced Materials, LLC.

Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications.

Technical Library | 2014-07-17 17:01:10.0

Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today’s modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits(...) This paper outlines a series of passive thermal improvements which are easily integrated into legacy, or existing, systems and can provide a 3-4x increase in dissipated power.

Advanced Cooling Technologies

Adhesive Bonding Instead Of Welding Or Bolting

Technical Library | 2019-05-01 10:07:37.0

Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.

Scheugenpflug Inc.

Test Solution for Heatsinks in Power Electronics Applications

Technical Library | 2021-03-24 01:30:47.0

Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover ...

Politecnico di Torino

Dispensing Thermally Conductive Materials

Technical Library | 2022-09-29 14:08:42.0

Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.

Scheugenpflug Inc.


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