Industry News | 2008-02-06 18:44:36.0
EAST WINDSOR, CT � February 6, 2008 � Blue Thunder Technologies Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it has numerous ESD products available.
Industry News | 2016-01-18 15:45:28.0
Blue Thunder Technologies introduces a new line of cleanroom compatible mouse pads.
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ The Allen-Bradley 1756-EN3TR is a communication bridge module that is part of the Allen-Bradley C
Industry News | 2007-11-01 01:27:50.0
Compared to standard halogen lighting, LED technology provides several benefits, including high-energy efficiency results in significantly reduced heat dissipation. Furthermore, they provide remarkably better luminance values (up to 400 Lumen) and a ten times longer lifespan than with standard halogen, making LED lighting the best choice to meet your rework and micro assembly challenges.
Industry News | 2013-12-10 12:51:58.0
Barry Industries introduces a RoHS compliant flange mount termination which dissipates 800W with minimal return loss over a DC to 1GHz bandwidth.
Industry News | 2020-12-18 19:15:24.0
Virtual Industries Inc. offers the ADJUST-A-VAC™ ESD-SAFE Kit with a special AUTO-SHUT-OFF feature. A sensor automatically turns on and off the ADJUST-A-VAC, helping users to be more productive, save energy, and extend life of the unit. The kit also includes the Buna-N Static Dissipative Non-Marking Vac.
Industry News | 2018-07-17 19:28:35.0
Virtual Industries features a product line of hand tools that replace tweezers or other gripping means for many applications. The PEN-VAC Kit with 8 Probes + Cups and Vacuum Pen Holder is a completely self-contained unit. There are not any batteries or hoses to get in the way.
Industry News | 2019-07-02 10:31:38.0
ACL Staticide® introduces the #880 Digital Megohmmeter to its line of static control instruments. Designed to be used specifically in Electrostatic Protected Areas (EPA) for testing static dissipative surfaces, this digital megohmmeter is highly accurate and dependable for point-to-point (RTT) and resistance-to-ground (RTG) compliance verification and qualification assessments. Results are shown on the meter in numeric value within 10e3 to 10e12 ohms. Shielding cables enhance reliability with high accuracy even at the outer ranges.
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
