New Equipment | Board Handling - Storage
Surface Mount Component Shipper Protects Many Sizes and Styles Eliminates Lead Damage Static Shielding Mailer with Dissipative Inserts 1,2,4 and 10 Paks Available Protect against lead damage SM ComPak® eliminates lead damage when shipping or ha
Industry Directory | Manufacturer
Our main business is ODM for WiFi, 5G, and Thermal products. It is a SMT-based electronic product assembly company that enables PBA-SMT through SMT know-how For OEM & EMS
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr Made by SHINLY plastics corporation www.shinly.com.tw
esd package (electro-static dissipating) antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: for 10 long dimm / 20 so dimm
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr Specification: 50 so dimm Made by SHINLY plastics corporation www.shinly.com.tw
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: Apple FB dimm dual channel Made by SHINLY plastics corporation www.shinly.com.tw
esd package electro-static dissipating antistatic for flash memory cards micro sdhc sd m2 ms pro duo cf Specification: for 80 x micro sd /micro sdhc Made by SHINLY plastics corporation www.shinly.com.tw
esd package electro-static dissipating antistatic for flash memory cards micro sdhc sd m2 ms pro duo cf Specification: for SD / SDHC / adaptor x 50pcs Made by SHINLY plastics corporation www.shinly.com.tw
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
