Industry News | 2011-08-01 16:38:05.0
Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions.
Industry News | 2015-12-01 12:48:55.0
The team of technology leader ASM Assembly Systems can look back on an extraordinarily successful Productronica 2015. In the impressive booth, which was largest yet covering 650 square meters, visitors had to fight for space to view “live” the progress the company has made on the path to the Smart #1 SMT Factory. Equally popular were the workshops and product presentations ASM Assembly System’s offered during the technology inhouse show at its Munich headquarters. Highlights at both locations included the SIPLACE BulkFeeder for tape-free component feeding, the new DEK NeoHorizon printers in interaction with the ASM ProcessExpert as the first self-learning inline expert system for SMT production, and integrated SIPLACE solutions for material logistics. The new ultra-compact SIPLACE TX high-volume placement modules received Global SMT & Packaging’s innovation award in the “High-Volume Placement” category. Also popular was a study which ASM developers presented in cooperation with robotics manufacturer KUKA. It demonstrated how intelligent, self-propelled robots can help line operators refill components or pick up component reels from the automatic SIPLACE Material Tower storage system.
Industry News | 2021-02-15 09:25:46.0
Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, will participate in a free panel discussion on Tuesday, 23 February 2021 at 10:30AM EST. Register today and secure your seat in the virtual event to learn from Koh Young and others how to optimize the box build assembly process.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Industry News | 2022-04-13 10:15:50.0
Indium Corporation's Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the company's popular InSIDER Series of webinars. The presentation, Design of Experiments (DOE) for SMT 101, will take place on Tuesday, May 3, at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.
Industry News | 2014-06-19 04:08:47.0
Prior to SMTA International we will be holding a pre event webinar which will be free for engineers to attend. It will provide an overview of the different process technology, process defects and showcase the show feature area covering High Temperature Electronics. The webinar will be held on Wednesday 10th September and presented by:
Industry News | 2022-01-05 09:15:19.0
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 25-27, 2022 in San Diego, California. After a lengthy lock-down, Koh Young will embrace the comprehensive safety and hygiene protocols in place to ensure a safe environment for attendees, so that the industry can meet face-to-face. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1717) and the Factory of the Future Pavilion (1701). The following is just a glimpse into what Koh Young will have in store for our visitors.
Industry News | 2010-03-10 16:12:57.0
Medway, MA — March 2010 —Milara Incorporated, a leader in stencil printing technological innovation, announces the integration of the CyberOptics 3-D post-print inspection head on its TouchPrint Digital TD2929 inline printer. The system will be on display at IPC/APEX 2010 in booth #959.
Industry News | 2012-02-15 21:13:52.0
In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
.gif)
