Full Site - : doe printing (Page 17 of 140)

StampTest Ltd.

Industry Directory | Manufacturer

The new stamp of authority in RoHS

SIPAD Systems, Inc.

SIPAD Systems, Inc.

Videos

SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi

SIPAD Systems Inc.

A Look Back: 65 Years in Manufacturing

A Look Back: 65 Years in Manufacturing

Videos

A collection of old manufacturing pictures.

Epec Engineered Technologies

The PCB Used In Marine Industry Paving Way For Innovations

Technical Library | 2016-08-02 06:10:56.0

As the technology has become a universal key to major developments, the marine and boat industry has shown elevated growth in recent time. The marine market circumscribes on the electronic and design solutions for every single innovation. All the developments in Marine sector has and are heading towards a notion of modernization and among these, printed circuit board is grounding the research and developments. How to increase the efficiency of the device? How to gain optimum fuel efficiency? Does the dual fuel concept become a buzz word for major innovations? These are the basic questions which are considered to bring new novelties in the market.

Technotronix

Board Design and Assembly Process Evaluation for 0201 Components on PCBs

Technical Library | 2023-05-02 19:06:43.0

As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.

Flextronics International

Panasonic SPG Screen Printer

Panasonic SPG Screen Printer

New Equipment | Printing

Lean, high speed, screen printing. Adaptable to dual lane for faster production, the Panasonic SPG can also handle large boards. A great companion for the AM100 Placement Machine Panasonic's SPG high-speed screen printing machine is the ultimate

Panasonic Factory Solutions Company of America (PFSA)

Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018

Industry News | 2018-04-24 21:17:46.0

Shanghai, China - Under the slogan “True 3D now powered by AI Platform,” Koh Young Technology will highlight its latest connectivity KSMART Process Optimizer (KPO) for optimizing printers in booth 1B60 at NEPCON China from 24-26 April,2018. Pursuing AI-driven automation, Koh Young has been working with its KSMART partners like MPM printer line and EKRA printer line to realize machine connectivity and a zero-defect production line.

Koh Young America, Inc.

ERSA VERSAPRINT 2 Stencil Printers

ERSA VERSAPRINT 2 Stencil Printers

New Equipment | Printing

A Revolutionary Print Solution with Integrated Post Print AOI The VERSAPRINT series not only handles the automatic cleaning of the underside of the stencil and inspection of the printing result, with a choice of 2D or 3D inspection, it also carries

kurtz ersa Corporation

Universal Instruments HSP4797L Chipshooter

Universal Instruments HSP4797L Chipshooter

Used SMT Equipment | Chipshooters / Chip Mounters

Auction # 40 From Multiple Locations: www.xlineassets.com Key Equipment: • Universal HSP 4797L Chipshooter, SN 10085098, Includes (40) Assorted Feeders (15) HD0804, (15) HE0804, (3) HE1204, (3) HE1208, (2) HE1600, (2) HE2400, Jabil # 50004990

X-Line Asset Management

Teradyne Teradyne Z1888 ICT Test System

Teradyne Teradyne Z1888 ICT Test System

Used SMT Equipment | In-Circuit Testers

Teradyne Z1888 ICT Test System   Auction # 40 From Multiple Locations: www.xlineassets.com Key Equipment: • Universal HSP 4797L Chipshooter, SN 10085098, Includes (40) Assorted Feeders (15) HD0804, (15) HE0804, (3) HE1204, (3) HE1208, (2) H

X-Line Asset Management


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SMTAI 2024 - SMTA International

Component Placement 101 Training Course
PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
Sell Your Used SMT & Test Equipment

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