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DFT(Design For Testability)Software

New Equipment | Design Services

DFT(Design For Testability)Software Tebo TA V5.0 ( DFT Design for testability of software)  Is unique within the electronics industry also has CAD Gerber Input connector professional / Fast Design for Testability analysis software. Can quickly and

Shenzhen Tebo Software Technology Co.,Ltd.

Essentials about Printed Circuit Board Assembly

Technical Library | 2019-10-18 10:37:25.0

It usually does not make any logic to invest in costly fabrication equipment in case you just desire to spin some prototypes and rather outsource your Printed Circuit Board assembly as well as prototype fabrication to a trustworthy vendor. I would provide a few tips as to what to consider when seeking a contract manufacturer. The two most common procedures associated with Printed Circuit Board Assembly are through-hole technology and surface mount technology. Talking about the difference between through-hole technology and surface mount technology. Through-hole elements have metal leads, & these metal leads are supplied through-plated holes inside the circuit board. On the other hand, SMT elements might or might not have leads, nevertheless most significantly, they are developed to be soldered onto the surface of the circuit boards straight on the same side as the element body. A lot of contract manufacturers would provide a quick quote mechanism over their site for the fabrication of circuit boards as well as assembly of prototypes. This would bank your time when comparing various vendors. Ensure that the quote system facilitates you to fill your details, for instance, board material, thickness, copper thickness, milling, etc. in order that you can avail of a precise quote devoid of any surprises afterward. And this is quite necessary. Typically the cost per board would decline as quality upgrades. This is owing to the fairly high setup price of circuit board fabrication over and above component assembly. A few vendors would employ a system where they unite boards from various consumers. This manner the setup price would be circulated among numerous clients. When you fabricate an item, you clearly don’t desire to have to fabricate a big quantity of boards straight away whilst you improve your design. One restriction with small quantity prototypes though is that the option of materials & material thicknesses would be constrained. In case you are employing a particular material then opportunities are there will not be any other clients employing the same material. Additionally, lead time plays a major role in indecisive prices. A longer lead time facilitates the fabricator more liberty in slotting your fabrication. This is basically reflected in cheaper prices that would view in the quote section. Clearly, if you are in a hurry and desire to be moved to the summit of the pile you would require splurging more dollars. Ensure that your contract fabricator would support the file sort for producing which you offer. The most general format for printed circuit board fabrication is the Gerber format nonetheless a few vendors would moreover embrace board files from general printed circuit board software products. A few suppliers also provide in house printed circuit design. Even in case, you create your board yourself, choosing a vendor with design services might prove resourceful in case there is an issue with your files. In this scenario, your vendor could make swift changes that would neglect pricey delays. If you are looking for an Electronic Manufacturing Services (EMS Assembly) provider, then the web is the best to search.

Optima Technology Associates, Inc.

To Quantify a Wetting Balance Curve

Technical Library | 2017-10-19 01:17:56.0

Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.

Enthone

PCB Production

Industry News | 2009-02-16 09:55:44.0

Board Manufacturing

Saturn Electronics Corporation

Epec Celebrating 65 Years of Manufacturing Excellence

Industry News | 2017-01-11 11:54:22.0

[January 11, 2017: New Bedford, MA] This January marks a major milestone for Epec, LLC as they celebrate 65 years of manufacturing excellence. As the oldest printed circuit board company in North America, Epec demonstrates why they are one of the top industry leaders in custom build to print electronics.

Epec Engineered Technologies

Immersion gold VS Plating gold

Videos

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious tr

Headpcb

3-D Printed Electronics Additively Manufactured Electronics (AME)

Technical Library | 2023-06-02 17:37:43.0

This presentation of Nano Dimension Ltd. (the"Company") contains "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act and other securities laws. Words such as "expects," "anticipates, " "intends, " "plans, " "believes, " "seeks, " "estimates" and similar expressions or variations of such words are intended to identify forward-looking statements. For example, the Company is using forward-looking statements when it discuss the potential of its products, strategic growth plan, its business plan and investment plans, the size fits addressable market, market growth, and expected recurring revenue growth. Forward-looking statements are no historical facts, and are based upon management's current expectations, beliefs and projections, many of which, by their nature, are inherently uncertain. Such expectations, beliefs and projections are expressed in good faith. However, there can be assurance that management's expectations, beliefs and projections will be achieved, and actual results may differ materially from what is expressed in or indicated by the forward-looking statements. Forward-looking statements are subject to risks and uncertainties that could cause actual performance or results to differ materially from those expressed in the forward-looking statements. For a more detailed description of the risks and uncertainties affecting the Company, reference is made to the Company's reports filed from time to time with the Securities and Exchange Commission ("SEC"), including, but not limited to, the risks detailed in the Company's annual report for the year ended December 31st, 2020, filed with the SEC. Forward-looking statements speak only as of the date the statements are made. The Company assumes no obligation to update forward-looking statements to reflect actual results, subsequent events or circumstances, changes in assumptions or changes in other factors affecting forward-looking information except to the extent required by applicable securities laws. If the Company does update one or more forward-looking statements, no inference should be drawn that the Company will make additional updates with respect thereto or with respect to other forward-looking statements.

Nano Dimension

Eyepoint p10

Eyepoint p10

Videos

Overview of EyePoint P10 system

Engineering Physics Center of MSU

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-2001 Model: Eureka SDC-2001 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% R

SMT Dry Cabinets by Eureka Dry Tech

Eureka SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: Model: SDC-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less. Ex

SMT Dry Cabinets by Eureka Dry Tech


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