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Printer and Reflow Oven Recommendations

Electronics Forum | Thu May 21 08:29:05 EDT 2015 | cyber_wolf

DeanM, How do you verify you have great results with the AutoSet feature if you do not check your profiles ? How does the AutoSet take into account large ground planes on certain areas of the board ? just curious

300 degrees C enough for LF?

Electronics Forum | Mon Dec 17 12:26:17 EST 2007 | slthomas

In addition to what robqd3 said, just because you can set your oven to 300� C doesn't mean that (a) it's providing 300� C air, or (b) that your oven will survive the temperatures required to reflow your boards properly. Confirming (a) does mean pro

BGA Rework

Electronics Forum | Wed Apr 28 15:08:10 EDT 2004 | russ

This could be a long shot but here goes. I have found that if flux is applied in excess that it will actually "move the solderballs" during reflow. I have actually seen where the balls are completely outside the package and oviously there are short

Sn100C HASL Finish on PCB

Electronics Forum | Wed Jan 26 17:36:22 EST 2011 | ck_the_flip

had a quick question regarding compatibility of Sn100C HASL finish and regular Sn63 solder paste. Does the thermal profile have to reach Sn100C eutectic temps. in order for the Sn 100C HASL to coaelesce with the Sn63 Solder paste? How reliable is t

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas

Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi

Chip capasitor plating

Electronics Forum | Mon Jan 09 08:47:27 EST 2006 | azbvc

Hi guys.. I just want to know on what are common types of terminal plating on chip capasitor and does each plating will affect reflow profile? Thank..

PCB Warpage in Reflow

Electronics Forum | Fri Jul 13 17:01:50 EDT 2007 | sean10

Thanks for your inputs. The board construction seams to be balanced and boards comes back to flat after top side process. we'll be performing experiement variing the profile parameters. if that does not do it, any printing suggestings? Would more sq

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Sun Sep 07 17:29:27 EDT 2008 | gregoryyork

Does look like a poor reflow profile needs to be hotter, is it Pb free

Wave Profile

Electronics Forum | Mon Oct 13 17:50:30 EDT 2003 | davef

IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)" As you observe, the temperature you measure will depend on what you are measuring. For instance: * Hottest temperature in the oven - air in the oven * Hott

Profile Frequency

Electronics Forum | Mon Jun 04 16:27:55 EDT 2012 | jorge_quijano

Hello there, I just want to ask you how often do you take your profiles on the Reflow Oven and Wave solder? I have a HMLV line running 5-6 products per shift (Reflow Oven & WS) my tech spend too much time checking the profile, but no major difference


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