Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Fri Nov 04 02:23:58 EST 2005 | grantp
Hi, Yes, you will save a lot of money in the end. From what I have experienced you cannot heat up a oven full of air, and cool it down fast enough to match a suitable reflow profile. So passing the board through the zones using an inline oven is th
Electronics Forum | Mon Nov 01 03:09:05 EST 2004 | Grant
Hi, I would get a KIC profiler, and put thermocouples on the PCB to get a correct profile. You can enter your specs into the software, and it will give you a simple percentage letting you know where you are inside your process window. 0 is perfect i
Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson
I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B
Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Mon Nov 02 22:57:02 EST 1998 | Kelly Gossman
Micheal, What does your profile look like for the wave? What profile does your flux say you need? My guess is it is not your profile, our testing with solder balls found that the mask on the boards was the largest contributor to solder balls. Wha
Electronics Forum | Tue Feb 11 13:41:54 EST 2003 | Stephen
How are you doing things now? I'm trying to picture a place going from no reflow oven to a reflow oven without also getting a screen printer at the same time. Are you now handsoldering parts on? With these batchs you plan on doing are you going to
Electronics Forum | Tue Aug 10 16:57:29 EDT 1999 | JohnW
| | Does anyone use reflow profilers? Are they a good investement or is trial and error sufficient? | | | | Does anyone have any suggestions on profiles to try? Thanks. | | | Danielm | I would hazard a guess that most if not all of us production f
Electronics Forum | Mon Jun 18 11:54:35 EDT 2007 | grantp
Hi, The problem seemed to be across multiple batches of boards, so I think they were made correctly, and we don't use a carrier in the reflow oven. However we just moved our equipment to the new factory yesterday, and connect and start turning on
