Electronics Forum | Mon Jun 18 11:54:35 EDT 2007 | grantp
Hi, The problem seemed to be across multiple batches of boards, so I think they were made correctly, and we don't use a carrier in the reflow oven. However we just moved our equipment to the new factory yesterday, and connect and start turning on
Electronics Forum | Wed Mar 24 15:48:33 EST 2004 | davef
KIC Thermal Profiling did a DOE [Nepcon West 1999] [you probably can find it posted on their site] on thermocouple attach. Comparing the reliability and repeatability of thermocouple attachment methods: * High temperature solder was found to be the
Electronics Forum | Mon Apr 12 07:44:50 EDT 2004 | wgaffubar
Former company we use to replace No Lead BGA's by using dot dispense to apply eutectic solder to pad with same volume the stencil printer. Current company process removes bad BGA, wicks off solder paste then Hot Gas Reflows new No Lead BGA to bare pa
Electronics Forum | Thu Apr 09 12:11:19 EDT 1998 | raymond
Does anyone has any experience using the Prophet Thermal Manager by KIC Thermal Profiling for real time monitoring and control of reflow oven profile ?
Electronics Forum | Thu Apr 09 12:35:16 EDT 1998 | Earl Moon
| Does anyone has any experience using the Prophet Thermal Manager by KIC Thermal Profiling for real time monitoring and control of reflow oven profile ? Yes. What is your concern. Earl Moon
Electronics Forum | Thu Nov 29 10:40:46 EST 2001 | franciscoioc
I have a datapaq 2000 profiler with a version 1.31 software and it saids it can only be used with windows 3.1. Does anyone have a copy of a later version software that i can use on windows 98 for this profiler.
Electronics Forum | Mon Apr 21 23:08:03 EDT 2008 | dman97
Hi, Does anyone know what kind of cable the thinline profiler uses? I recently acquired one of these profilers, but it came with no cables. I went out and bought a female to female serial cable, but it did not work. It will not communicate with my P
Electronics Forum | Fri Oct 05 08:35:52 EDT 2001 | Hussman
Hey Steven, Achieving the proper profile like you described does require you to engineer proper conveyor speeds and zone temps. Most conveyorized ovens have the inside of the ovens divided into zones. Each zone has a top and bottom heater that can
Electronics Forum | Fri Sep 11 13:57:24 EDT 1998 | Justin Medernach
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
