Full Site - : doe profile (Page 26 of 87)

Oven Profile

Electronics Forum | Mon Mar 08 19:41:31 EST 2004 | Ken

Robert, what you have provided is not a "profile". It is a "recipe" or "job". I have 4 BTU VIP98's. I have hundreds of recipes...Your temps look similar to mine....but what does that have to do with the "thermal profile" as experienced by the asse

Seica Firefly - Issues?

Electronics Forum | Wed Mar 12 13:59:54 EDT 2008 | carsan

I am looking for some feedback on the Seica Firefly Laser Soldering System. We saw a demo and were somewhat impressed but would like to hear from anyone that has any practical experience using one. Specifically, we noticed that you have to select t

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean

Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de

Reflow Profile Design

Electronics Forum | Fri Jun 15 11:05:17 EDT 2007 | grantp

Hi, This is a little embarrassing asking this question, as I think I am profiling our oven incorrectly. I have been using the profile based on the solder paste specification, however we have been getting a large BGA chip coming more unreliable, and

Researching placement machines - where do I start?!

Electronics Forum | Thu Nov 05 09:50:14 EST 2009 | adlsmt

Before you buy a manual screen printer try to do it by hand. We hand stenciled boards with 19mil pitch parts for three years with decent results, with your parts it should be simple. lay the board on a piece of ESD bubblewrap, the kind with small bub

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon

| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t

Wave Solder Profiling Basics

Electronics Forum | Fri Jun 25 09:51:35 EDT 1999 | C.K.

| Dear John/Earl | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired profilin

Convection Oven Reflow Modeling Simulations

Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno

Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.

Convection Oven Reflow Modeling Simulations

Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno

Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny

I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel


doe profile searches for Companies, Equipment, Machines, Suppliers & Information