Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Wed Apr 19 14:07:20 EDT 2000 | Russ Cutler
Let me see if I've got this straight...rather than hook up a MOLE or a KIC profiler to each and every board (600 P/N's in my case), most people are making judgement calls based solely on how similar a board looks to another board, for which they have
Electronics Forum | Fri Dec 15 18:36:46 EST 2006 | Grant
Hi, I have noticed we are getting residue on our wave pcb's and it's worse with lead free, since we changed to the flux we are using. We are currently using Avantec VOC Free flux model Ecofree 303. It looks like it's made in Malaysia. Does anyone h
Electronics Forum | Thu May 14 10:00:14 EDT 2015 | swag
I like MpM personally - run forever and programming is easy and leads you through it. It's hard to miss a step of programming with MpM software. DEK's a little harder (for me) but still very nice controls. The pluses of DEK - DEK has a high freque
Electronics Forum | Mon Sep 28 13:03:43 EDT 2015 | dyoungquist
The melting point of the solder itself does not change when you have underfill. If the underfill conducts heat better than air, it will take less heat (and/or less time) from your rework station to get the solder up to the melting point. That makes
Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
.png)
