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SMD Gull Wing Switch Cracking

Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow

Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill

Re: Reflow Profiling

Electronics Forum | Tue Jul 11 15:59:52 EDT 2000 | JohnW

George, I looked at the winkic & profit software and tool's a while ago along with some of the alternatives. No matter what anyone tell's you in the 1st instance you do still need a profile card as what you are doing is comparing the known good prof

Topside Heat on Board

Electronics Forum | Fri Jun 02 12:18:47 EDT 2006 | Vince Whipple

Marc, Topside temperature is one of the most critical parameters for a successful solder process. Temp stickers are OK to use but won�t tell you the temperature in tight areas. The temp gun like Jay suggested is what I use as a quick indicator. (Rayt

Reflow profiling Units

Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL

Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi

Re: Profiling

Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey

| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |

Re: Profiling

Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones

| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e

Re: Wave Solder Profiling Basics

Electronics Forum | Fri Jun 25 16:54:25 EDT 1999 | C.K.

| | | Dear John/Earl | | | | | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | | | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the

Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan

I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook

| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW

| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi


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