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Reflow help needed, Hotflow 5

Electronics Forum | Fri Sep 09 18:19:25 EDT 2011 | cusackmusic

First of all, if you are going to tell me to throw my crappy equipment away, and buy a better oven because 3 zones isn't enough for lead free soldering, please find another thread to troll in. We have been using a Hotflow 3 for several years for lea

Re: Surface Mount Solder Balling

Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon

| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the

Re: Surface Mount Solder Balling

Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich

| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon

| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using

Open joints

Electronics Forum | Wed Oct 03 17:07:52 EDT 2001 | davef

We have had soldering problems with fine pitch QFP in the past [and probably will in the future]. Several questions leap to mind: * When you took your profile on the component pads, do you profile on the pads that did not solder well? * When you say

Design of experiments 2E2 help!

Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t

Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th

Re: Component solderability problems TO263 package

Electronics Forum | Wed Aug 09 22:00:44 EDT 2000 | Dave F

Hey Charles!!! Where in earthly heaven did you get a TO263 with "large solderable tab (approx 8mm square) on the back and 5 leads"? All the TO263s that�ve reached-up and smacked me have been "TO220s" with a modified tab and three leads that are f

Pinhole Solder Joint Reliability

Electronics Forum | Mon Jul 21 20:42:12 EDT 2003 | iman

Don, thanks for the thoughtful insight, can I run some thinking points for your further assistance? 1) ours is a Au over Ni PCB bareboard. Do you think excessive Au thickness is any way a influence for poor solder formation? I did notice the PCB ba

Batch Ovens

Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP

Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power

PCB delamination

Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio

I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and


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