Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon
| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using
Electronics Forum | Wed Oct 03 17:07:52 EDT 2001 | davef
We have had soldering problems with fine pitch QFP in the past [and probably will in the future]. Several questions leap to mind: * When you took your profile on the component pads, do you profile on the pads that did not solder well? * When you say
Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t
Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th
Electronics Forum | Wed Aug 09 22:00:44 EDT 2000 | Dave F
Hey Charles!!! Where in earthly heaven did you get a TO263 with "large solderable tab (approx 8mm square) on the back and 5 leads"? All the TO263s that�ve reached-up and smacked me have been "TO220s" with a modified tab and three leads that are f
Electronics Forum | Mon Jul 21 20:42:12 EDT 2003 | iman
Don, thanks for the thoughtful insight, can I run some thinking points for your further assistance? 1) ours is a Au over Ni PCB bareboard. Do you think excessive Au thickness is any way a influence for poor solder formation? I did notice the PCB ba
Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP
Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power
Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio
I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ
Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
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