Electronics Forum | Fri Dec 01 06:31:53 EST 2006 | CHITRA K
We use SMBJ5.0A - D0214A package component in our products.During production recently we have identified a seroius problem. The problem is, After reflow soldering the impedance becomes more / lesser and due to which the product does not work since th
Electronics Forum | Fri Feb 09 08:07:41 EST 2007 | jax
Has the board been looked at under X-Ray? Have you built more than 1 of the boards in question? Do any of the other boards have the same problem? Have you made any changes to the profile between boards? One side of the BGA collapsing during reflow w
Electronics Forum | Wed Mar 21 10:00:13 EDT 2007 | slthomas
"Unfortunately breakaways aren't an option - they are large boards and we already have problems hand placing components and probing them." Not sure what this means in this context....if you frame the perimeter with a 1/2" border on a V-score, how do
Electronics Forum | Mon Dec 17 09:38:56 EST 2007 | dborgelt
We have an outdated Metcal rework station and are thinking about purchasing a new one. We need something that has heat profile capability. We don't really need anything automated, just something that's affordable, durable, and gets the job done. Does
Electronics Forum | Wed Apr 30 12:26:10 EDT 2008 | dphilbrick
There must be discussions about this on SMTnet but I have yet to find them. I would like to hear from all you smart people about running LF and PB BGA�s on the same board using 63/37 solder. If you run your profile up to peak at around 225C +/- (nitr
Electronics Forum | Thu Aug 28 21:43:23 EDT 2008 | davef
Couple of points: * We'll tell ya, although it's tough to tell from these pix, but it does not look like dewetting. It looks like nonwetting. * We don't think you're getting this product hot enough. We don't know where you measured the profile you po
Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70
Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil
Electronics Forum | Mon Jun 01 17:41:20 EDT 2009 | gregoryyork
What is your squeegee pressure and size. Also does the pad sit on a ground plane, as it looks like it is partially reflowed so surface has gone but not coallesced properly which would indicate it is more a problem with reflow above 217-219C OR obviou
Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000
I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i
Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy
Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref
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