Electronics Forum | Thu Sep 03 04:53:31 EDT 2009 | d0min0
to summarize - 3 components are placed on a single module x 8 on pcb - 2 anodes & 1 cathode are infected (so no component for us) - the problem does not look like wetting problem as the component and land pad is wetted, but the paste is not complete
Electronics Forum | Thu Apr 01 14:43:26 EDT 2010 | cbart
You say its in both smt and through hole, but, are you waving the SMT parts as well, I assume yes since you think its dross in the joints. Questions: 1- do you have higher mag scopes that you can zoom in a little more to see if these are voids or dr
Electronics Forum | Fri Feb 24 02:04:50 EST 2017 | soldertraining
Selective Soldering Frames can pull large amounts of heat from the solder wave at the point of contact, effectively lowering the temperature of the solder at the solder joint. You should confirm the temperature of the solder joints by running a therm
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
Electronics Forum | Wed Mar 27 13:47:24 EDT 2019 | whitelancer64
I am having an issue with aligning vision for solder paste inspection with the PCB in the Momentum machine. The SMT operators setup the profile on the machine, which I then import into Aegis CircuitCAM to add PCB locations. But when I export again, t
Electronics Forum | Tue Feb 11 12:59:06 EST 2020 | astarotf
Hi Steve Thomas Effectively by IPC-610 standard specifies in the "content 8.2.13 Quad Flat Pack Plastic Package - Without Terminals (PQFN), Table 8-13, page 8-84" which depending on the class of manufacture notes 2-5 of the table, which in theory do
Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Tue May 26 20:24:39 EDT 1998 | Dave F
| Does anybody know a (if possible low-cost) system | which can travel with the PWBs through a reflov oven | (like some temperature profile loggers) for measuring | the residual oxygen? My problem is, it is a batch oven | which does not allow to h
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