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Re: Oxygen Measuerement in Reflow Oven

Electronics Forum | Tue May 26 20:24:39 EDT 1998 | Dave F

| Does anybody know a (if possible low-cost) system | which can travel with the PWBs through a reflov oven | (like some temperature profile loggers) for measuring | the residual oxygen? My problem is, it is a batch oven | which does not allow to h

Reflow Oven Profiling

Electronics Forum | Tue Apr 25 21:29:08 EDT 2006 | TMC

Thanks for all the replies. Rob . . . that's what I was looking to get feedback on; to see if others can program their reflow ovens so that double sided boards only reflow on top during the second pass. Our oven does have an edge belt conveyer so t

Re: Siemens

Electronics Forum | Fri Nov 05 17:17:32 EST 1999 | NickMata

Fred, The system will base itself on the information within the GF file. In the GF file you provide the description as to the physical dimensions, features, tolerances and handling for the part. Once the component has picked up the image, it is "see

Re: Tombstoning 0805s w/palladium/platinum/silver terminations

Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW

| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi

Re: Surface Mount Solder Balling

Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan

| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW

IC Contamination

Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef

I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl

Screen Printing for BGA

Electronics Forum | Wed Aug 27 14:41:49 EDT 2003 | Stephen

Have you checked the temperature profile at the balls? Just because a recipe works "fine most of the time" does not mean it is optimum. Do you have a machine that can measure co-planarity? If I get time I plan on using the MPA to look at co-plana

Re: BGA repair/rework

Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen

| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using

Re: BGA rework : IR or convection

Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson

| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha

Re: hybrid solder joints

Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.

| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil


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