Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Sun Apr 25 11:44:14 EDT 1999 | Earl Moon
| | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are usi
Electronics Forum | Sat Mar 06 12:33:21 EST 1999 | Dean
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Mon Jan 04 11:32:59 EST 1999 | Chrys
| Anyone have any experience with ECD's Waverider/MOLE profiling equipment? If so, were they positive experiences? | I use ECD's mole for profiling in the wave and a KIC for profiling in reflow. I like the KIC a whole lot better for a couple of re
Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus
| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are
Electronics Forum | Sun Apr 25 11:50:08 EDT 1999 | Earl Moon
| | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are u
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Wed Jun 24 11:59:31 EDT 1998 | Brian Conner
| What is your current solder pot temperature? Whatever that temperature is, | has it been verified/calibrated? | What kind of flux is being used? No-clean, OA, RMA? | How is the flux being applied to the PCB? | Is this problem occuring on ALL nega
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Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean
| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60
